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XCVC1702-2LSENSVG1369

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Shenzhen Jinsheng Weiye Electronics Co., Ltd

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XCVC1702-2LSENSVG1369

Category : Integrated Circuits (ICs) Embedded System On Chip (SoC)

Product Status : Active

Peripherals : DDR, DMA, PCIe

Primary Attributes : Versal™ AI Core FPGA, 1M Logic Cells

Series : Versal™ AI Core

Package : Tray

Mfr : AMD

Supplier Device Package : 1369-BGA (35x35)

Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Operating Temperature : 0°C ~ 100°C (TJ)

Architecture : MPU, FPGA

Package / Case : 1369-BFBGA

Number of I/O : 500

RAM Size : -

Speed : 450MHz, 1.08GHz

Core Processor : Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size : -

Description : IC VERSAL AI-CORE FPGA 1369BGA

Stock : In Stock

Shipping Method : LCL, AIR, FCL, Express

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 450MHz, 1.08GHz 1369-BGA (35x35)

XCVC1702-2LSENSVG1369 Images

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